2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane
Base Information
- Chemical Name:2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane
- CAS No.:14857-35-3
Quality products?make an important contribution to long-term revenue and profitability. Reliable Quality 2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane 14857-35-3 Hot Sale with Chinese Manufacturer
1.What is the 2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane ?
Used in Adhesives and Sealants Industry:
2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane is used as a coupling agent for improving the adhesion and mechanical properties of adhesives and sealants. Its ability to bond with both inorganic and organic materials ensures strong and durable bonds in various applications.
Used in Coatings Industry:
In the coatings industry, 2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane is used as a coupling agent to enhance the adhesion and durability of coatings on different substrates. Its compatibility with both inorganic and organic materials allows for the development of high-performance coatings with improved mechanical properties and resistance to environmental factors.
Used in Composites Industry:
2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane is used as a coupling agent in the production of composites to improve the interfacial adhesion between the inorganic and organic components. This results in composites with enhanced mechanical properties, such as increased strength and toughness.
Used in Polymer Systems as a Surface Modifier:
2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane is used as a surface modifier in polymer systems to enhance the performance of fillers and additives. Its ability to react with both inorganic and organic components allows for the improvement of the dispersion and interaction of fillers and additives within the polymer matrix, leading to enhanced mechanical and thermal properties of the final product.
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106-86-5
1,2-Epoxy-4-vinylcyclohexane
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2031-62-1
diethoxymethylane
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14857-35-3
Diaethoxy-<2-(3,4-epoxy-cyclohexyl)-aethyl>-methyl-silan
| Conditions | Yield |
|---|---|
|
With
platinum; iron(III) oxide; N,N-dimethyl-formamide;
In
neat (no solvent);
at 100 ℃;
for 24h;
Schlenk technique;
|
68% |
2.What is the CAS number for 2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane ?
The CAS number of 2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane is 14857-35-3.
More information of 2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane 14857-35-3 are:
|
CAS?Number |
14857-35-3 |
|
Density |
0.9312 g/cm3 |
|
Boiling Point |
114-117 °C(Press: 1 Torr) |
|
Refractive Index |
1.4248 |
|
HS CODE |
2932999099 |
|
PSA |
30.99000 |
|
LogP |
3.08900 |
3.What are another words for 2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane ?
Synonyms?for?2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane 14857-35-3:2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane;(2-(7-oxabicyclo[4.1.0]heptan-3-yl)ethyl)diethoxy(Methyl)silane;2-(3,4-EPOXYCYCLOHEXYL)ETHYLMETHYLDIETHOXYSILANE;3-[2-(Diethoxymethylsilyl)ethyl]-7-oxabicyclo[4.1.0]heptane
4.What is the molecular formula of 2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane?
The chemical formula of ?2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane is?C13H26O3Si which containing 13 Carbon atoms,26 Hydrogen atoms,3 Oxygen atoms and 1 Silicon atoms,and the molecular weight of??2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane?is 258.433.
5.What is 2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane (14857-35-3) used for?
2-(3,4-epoxycyclohexyl)ethylmethyldiethosysilane, also known as glycidyloxypropyltrimethoxysilane, is a versatile chemical compound that functions as a coupling agent, bridging the gap between inorganic substrates and organic polymers. Its unique structure, featuring a silane group for bonding with materials like glass, metal, or other inorganic substances, and an epoxy group for reacting with organic polymers, enables it to enhance the adhesion and mechanical properties of various materials. This dual functionality makes it a valuable component in the production of adhesives, sealants, coatings, and composites, as well as a surface modifier to improve the performance of fillers and additives in polymer systems.
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